Last Week Today, October 23, 2017

Submitted by Gabe Moretti on Mon, 10/23/2017 - 05:39

CEVA and LG Electronics Partner for Smart 3D Camera Solution

The 3D camera module incorporates a Rockchip RK1608 coprocessor with multiple CEVA-XM4 imaging and vision DSPs, which provide the processing power to perform a wide variety of 3D sensing applications. These include biometric face authentication, 3D reconstruction, gesture/posture tracking, obstacle detection, AR and VR. Computer vision experts from CEVA, Rockchip and LG worked closely together to optimize LG’s proprietary algorithms for the CEVA-XM4 using CEVA’s tool kit and optimized algorithm libraries ensuring optimal performance under stringent power constraints.

Synopsys Expands DesignWare IP Portfolio with Acquisition of Sidense Corporation

Synopsys, Inc. has acquired Sidense Corporation, a provider of one-time programmable (OTP) non-volatile memory (NVM) for automotive, mobile, industrial and Internet of Things (IoT) applications. The acquisition complements Synopsys' existing DesignWare® Multi-Time Programmable (MTP) NVM IP solution with OTP NVM IP in 16-bit to 1.28-Mbit configurations. With this acquisition, Synopsys gains access to proven, market-leading OTP NVM IP in process technologies from 180- to 16‑nm along with a team of highly experienced R&D engineers.

Sidense's embedded one-transistor OTP technology is based on its patented split-channel 1T-Fuse™ bit-cell architecture that provides better yield, higher security, improved reliability and lower overall product cost. Sidense's antifuse-based OTP NVM technology offers ultra-low power, small area NVM IP with read access times as fast as 10 nanoseconds. The OTP NVM IP can be manufactured in standard-logic CMOS fabrication processes and does not require any additional mask layers or process steps. The IP is in high-volume production in automotive, mobile and industrial applications.

Microsemi Launches Mi-V Ecosystem

RISC-V, an ISA which is a standard open architecture under the governance of the RISC-V Foundation, offers numerous benefits, including portability as well as enabling the open source community to test and improve cores at a faster pace than closed ISAs. As the RISC-V intellectual property (IP) core is not encrypted, it can be used to ensure trust and certifications not possible with closed architectures. Microsemi's new Mi-V ecosystem brings together a number of industry leaders involved in the development of RISC-V to leverage their capabilities and streamline RISC-V designs for customers.

Microsemi's Mi-V ecosystem, part of Microsemi's Accelerate Ecosystem, contains a number of components. Design tools include Microsemi's SoftConsole Eclipse-based integrated development environment (IDE), the firmware catalog and Libero PolarFire system-on-chip (SoC). Operating systems include Express Logic's ThreadX, Huawei LiteOS and Micrium µC/OS-II. Boards include the RTG4™ development kit, IGLOO™2 RISC-V board from Future Electronics, PolarFire Evaluation Kit and more. Debug dongles from Microsemi and Olimex,  first-stage bootloaders and numerous soft peripherals are also included. Example projects, drivers and firmware are all available on GitHub, the world's largest repository of open source software.