Last Week Today, September 25, 2017

Submitted by Gabe Moretti on Sun, 09/24/2017 - 23:16

Gabe Moretti

Brite Semiconductor (Brite), Semiconductor Manufacturing International Corporation (SMIC) and Synopsys (SNPS) announced a collaboration resulting in an IoT platform that enables designers, system integrators and OEMs to accelerate and differentiate their next-generation IoT systems. The platform consisting of Synopsys' DesignWare® ARC® Data Fusion Subsystem with ARC EM9D processor, USB, I3C and Mobile Storage IP solutions was integrated by Brite design services using SMIC's 55-nm ultra-low power (ULP) process. The collaboration resulted in the successful development of a test chip demonstrating up to 45 percent reduction in dynamic power and 70 percent reduction in leakage power compared to SMIC's 55LL process technology. This platform provides customers with a proven starting point for creating their IoT designs and enables the integration of customized functions on demand, while lowering costs. In addition, Synopsys is offering an ARC IoT Development Kit based on the platform to ease software development for ARC processor-based systems.

GLOBALFOUNDRIES announced the availability of a new set of enhanced RF SOI process design kits (PDKs) to help designers improve their designs of RF switches and deliver differentiated RF front-end solutions for a wide range of markets including front-end modules for mobile devices, mmWave, 5G and other high-frequency applications.

IMPERAS supports Synopsys ARCv2 EM Processors within their Virtual Platforms Solutions.

The comprehensive virtual platform environment for embedded software development, debug and verification for DesignWare ARCv2 EM cores includes Fast Processor Models and Extendable Platform Kits™ (EPKs™), with high-performance simulation, software debug, verification, analysis, and profiling (VAP) tools, and OS booting on the virtual platforms.

MENTA announced that its embedded FPGA (eFPGA) IP is fully qualified for GLOBALFOUNDRIES’ (GF) advanced 14nm FinFET and 32nm SOI process technologies. Offered as part of GLOBALSOLUTIONS® Ecosystem, the eFPGA IP provides designers with a fully programmable FPGA fabric that can be embedded into any design. The eFPGA fabric allows modifications to the hardware both during development and post manufacturing, thereby reducing development time and cost.

SPATIAL CORP., a subsidiary of Dassault Systemes, and MODULEWORKS, the leading supplier of CAD/CAM software development toolkits for machining and simulation, have developed SDKs (aka software components) that offer CAD/CAM vendors complete workflow solutions for additive and hybrid machining.

For the past several years, both Spatial and ModuleWorks have enjoyed a successful cooperation and share a large customer base that benefits from the synergy between their SDKs. This cooperation between Spatial and ModuleWorks ensures fast and flexible integration of libraries from both companies into CAD/CAM applications, accelerating the development of advanced, cost-effective workflow solutions for their customers.


SYNOPSYS announced the new DesignWare® ARC® IoT Development Kit to accelerate software development and debug of ARC processor-based system-on-chip (SoC) designs. The ARC IoT Development Kit includes a silicon implementation of the ARC Data Fusion IP Subsystem as well as a rich set of peripherals commonly used in IoT designs such as USB, I3C and PWM. The Development Kit is supported by Synopsys' MetaWare Development ToolKit, which includes a compiler, debugger and libraries optimized for maximum performance with minimal code size. In addition, the embARC Open Software Platform gives developers online access to device drivers, application examples and a suite of free and open-source software that enables them to speed software development for their ARC-based embedded systems.

SYNOPSYS, announced it has completed its acquisition of QuantumWise, a leading provider of simulation tools for materials modeling in early manufacturing process development. With this acquisition, Synopsys will enhance its support of semiconductor manufacturers who are evaluating a wide variety of new materials to extend Moore's law and develop novel memories. Founded in 2008, QuantumWise is a leading supplier of software tools for atomic-scale modeling of materials, with more than 400 commercial and academic customers worldwide. The QuantumWise tools simulate the properties of materials based on fundamental quantum mechanical theories to improve product performance across many applications, including semiconductors and electronics.

SYNOPSYS, today announced its collaboration with GLOBALFOUNDRIES (GF) to develop DesignWare® IP, including PHYs for USB 3.1/3.0/2.0, USB-C 3.1/DisplayPort, PCI Express® 3.1/2.0 and HDMI 2.0 TX, as well as data converters, for GF's 22FDX® process technology. Synopsys DesignWare IP on the 22FDX process enables designers to implement the latest interface and analog IP standards in their system-on-chips (SoCs) on GF's 22-nm Fully-Depleted Silicon-On-Insulator (22FDX) technology that delivers 25 percent smaller die size and 40 percent lower power than 28-nm HKMG technologies. The collaboration extends Synopsys' history of successful IP development on GF's processes for small, energy-efficient IoT and mobile SoCs.

TDK Sensors Developers Conference, its wholly-owned subsidiary InvenSense, a leading provider of MEMS sensor platforms, is hosting the 2017 TDK Sensors Developers Conference (SDC) under the theme, “World of Sensors.” As one of the world’s largest MEMS and sensors developers’ conferences, the SDC will introduce new sensor technologies and solutions from the TDK Group, including TDK, EPCOS, ICsense, InvenSense, Micronas and Tronics products. The SDC will take place on October 23-24, 2017 at the Santa Clara Marriott Hotel in Santa Clara, CA.

TELINK SEMICONDUCTOR, developer of highly integrated low power radio-frequency and mixed signal system chips for internet of things (IoT) applications, will be demonstrating a number of applications for smart lighting, smart home, retail and logistics based on its devices at the Bluetooth Asia 2017 conference taking place in Shenzhen, China on 26-27 September 2017.